Ultrasonic Scattering Spray Nozzle













Application
The typical application of the scattering ultrasonic nozzle is the photoresist coating of semiconductor wafers, where the photoresist is sprayed on the semiconductor wafer. Since the mist sprayed by the scattering ultrasonic nozzle is rotationally scattered, it can form a uniform photoresist film not only on the wafer plane, but also on the side walls and corners of the wafer microstructure. In addition, the scattering ultrasonic nozzle can also be used for thin-film solar cell coatings, calcium titanate solar cell coatings, AR transmission and reflection film coatings, thermal insulation film coatings, super hydrophobic coatings, PCB flux coatings and other applications.
0102030405
Demonstration
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